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Conclusion:
The following qualification successfully meets the quality and reliability standards required of all Dallas
Semiconductor products and processes:
DS1961S
In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing
product will continue to meet Maxim's quality and reliability standards. The current status of the
reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.*
Module Description:
A description of this Module can be found in the product data sheet. You can find the product data
sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.*
Reliability Derating:
A module device consists of one or more IC's in a single, upward integrated, package. This
package is assembled to include batteries, crystals, and other piece parts that make up the
configuration of the Module. Because of either the complexity of the package or the included piece
parts, standard high temperature reliability testing is not possible. Therefore, in order to determine
the reliability of module products, the reliability of each of the piece parts is individually determined,
then summed to determine the reliability of the integrated module product. If there are "n" significant
components in the module then:
Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n)
Fr (module) = Failure rate of module
Fr(n) = Failure rate of the nth component
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate
is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
The calculated failure rate for this module/assembly is:
Module Device:
DS1961
Totals:
Quantity:
1
MTTF (Yrs):
18096
18096
FITs:
6.3
6.3
The parameters used to calculate the module failure rate are as follows:
Cf: 60%
Ea: 0.7
B: 0
Tu: 25
°C
Vu: 5.5
Volts
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相关PDF资料
DS1963S-F5+
IBUTTON MONETARY SHA-1
DS1971-F3+
IBUTTON EEPROM 256KBIT F3
DS1972-F3+
IBUTTON EEPROM 1KBit F3
DS1973-F3+
IBUTTON EEPROM 4KBit F3
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IBUTTON EEPROM 32KBit F5
DS1982-F5+
IBUTTON 1KBit ADD-ONLY F5
DS1985-F3+
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DS1990A-F3+
IC IBUTTON SERIAL NUMBER F3
相关代理商/技术参数
DS1961S-F3+
功能描述:iButton 1kb Protected EEPROM iButton w/SHA-1 Eng RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated
DS1961S-F5
功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated
DS1961S-F5#
功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated
DS1961S-F5#W
功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated
DS1961S-F5+
功能描述:iButton 1kb Protected EEPROM iButton w/SHA-1 Eng RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated
DS1963L
制造商:未知厂家 制造商全称:未知厂家 功能描述:4 kbit Monetary iButton
DS1963L-F5
功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated
DS1963L-F5+
功能描述:iButton RoHS:否 存储类型:SRAM 存储容量:512 B 组织: 工作电源电压:3 V to 5.25 V 接口类型:1-Wire 最大工作温度:+ 85 C 尺寸:17.35 mm x 5.89 mm 封装 / 箱体:F5 MicroCan 制造商:Maxim Integrated